CIT Co., Ltd. promoted its newest dielectric FCCL(Flexible Copper-Clad Laminate) for telecommunication infrastructure with high data transmission.
CIT(Copper Innovation Technology) is a company that develops and produces IT materials using metals like copper. Since its establishment in March last year, many investors and global leaders have begun to pay attention to this company.
With the rise in data usage, the need to transmit large amounts of data will come quickly, and beyond 5G communication will come soon, called the "Next Generation." In the Next Generation era, CIT expects society's major frequency to change to a high-frequency band.
CIT's main product is a dielectric FCCL suitable for high-frequency band(30~100 GHz) communication. FCCL is used in telecommunication antenna and FPCB(Flexible Printed Circuit Board). Many electronic devices contain several or several FPCBs made of FCCL. The lower the dielectricity of FCCL, the faster and more stable data can be transferred simultaneously.
Traditionally, PI(Polyimide) and LCP(Liquid Crystal Polymer) are often used as FCCL materials. However, PTFE(Polytetrafluoroethylene) has a lower dielectric constant and dielectric loss than them. This means that PTFE has much lower transmission loss than PI and LCP.
Although PTFE has a low intrinsic permittivity, commercialized PTFE-based FCCLs had a higher permittivity due to the use of adhesives than the theoretical permittivity because there was no technology to adhere copper on PTFE without adhesives. On the other hand, CIT's PTFE-based FCCL has developed a technology to deposit copper directly on PTFE without adhesive. CIT said this product has a lower dielectric constant and dielectric loss than Murata's PTFE FCCL, the industry's number-one product.
CIT's products on display | Photo by AVING NewsUsing atomic sputtering epitaxy, known as ASE technology, one trillion copper atoms are arranged within one cubic centimeter. This new product can transmit data at up to 100GHz without signal loss. CIT's product characteristics will enable thinner FPCBs to be used in high-frequency band communications, and they are expected to replace products from other global players. In 2022 and 2023, CIT's ASE technology was published in Nature, the world's best science journal.
Because of this excellence, several venture capitalists have shown interest in and want to support CIT. After a valuation of 5.6 billion KRW(4.3 million USD), it completed the seed investment round of 1.1 billion KRW(0.9 million USD) in September 2023. After finishing this bridge round within this month, it is valued at 14 billion KRW(~10 million USD).
CIT networks with leading global partners, such as Huawei or Harvard Medical School, in the telecommunications and medical fields. CIT has been steadily participating in international exhibitions such as the World IT Show 2024(WIS2024) and Mobile World Congress 2024(MWC2024), establishing its position in the worldwide market. In addition, PTFE-based FCCLs are expected to gain a larger market position due to their versatility in Next-G communications markets such as autonomous vehicles, urban air mobility (UAM), AI, and IoT.
Seung Jeong, the CEO of CIT, reaffirmed the company's commitment to growing and meeting customer demands. He stated, "Our technology is essential across all industries, and it attracted interest from various sectors, including electronics and medical devices. In light of this, we prioritize the company's growth and enhance production capacity, and we actively seek investment in further advancement of our technology."
DK Kim Reporter davis@aving.net
출처 : AVING NEWS(https://us.aving.net)
CIT Co., Ltd. promoted its newest dielectric FCCL(Flexible Copper-Clad Laminate) for telecommunication infrastructure with high data transmission.
CIT(Copper Innovation Technology) is a company that develops and produces IT materials using metals like copper. Since its establishment in March last year, many investors and global leaders have begun to pay attention to this company.
With the rise in data usage, the need to transmit large amounts of data will come quickly, and beyond 5G communication will come soon, called the "Next Generation." In the Next Generation era, CIT expects society's major frequency to change to a high-frequency band.
CIT's main product is a dielectric FCCL suitable for high-frequency band(30~100 GHz) communication. FCCL is used in telecommunication antenna and FPCB(Flexible Printed Circuit Board). Many electronic devices contain several or several FPCBs made of FCCL. The lower the dielectricity of FCCL, the faster and more stable data can be transferred simultaneously.
Traditionally, PI(Polyimide) and LCP(Liquid Crystal Polymer) are often used as FCCL materials. However, PTFE(Polytetrafluoroethylene) has a lower dielectric constant and dielectric loss than them. This means that PTFE has much lower transmission loss than PI and LCP.
Although PTFE has a low intrinsic permittivity, commercialized PTFE-based FCCLs had a higher permittivity due to the use of adhesives than the theoretical permittivity because there was no technology to adhere copper on PTFE without adhesives. On the other hand, CIT's PTFE-based FCCL has developed a technology to deposit copper directly on PTFE without adhesive. CIT said this product has a lower dielectric constant and dielectric loss than Murata's PTFE FCCL, the industry's number-one product.
CIT's products on display | Photo by AVING NewsUsing atomic sputtering epitaxy, known as ASE technology, one trillion copper atoms are arranged within one cubic centimeter. This new product can transmit data at up to 100GHz without signal loss. CIT's product characteristics will enable thinner FPCBs to be used in high-frequency band communications, and they are expected to replace products from other global players. In 2022 and 2023, CIT's ASE technology was published in Nature, the world's best science journal.
Because of this excellence, several venture capitalists have shown interest in and want to support CIT. After a valuation of 5.6 billion KRW(4.3 million USD), it completed the seed investment round of 1.1 billion KRW(0.9 million USD) in September 2023. After finishing this bridge round within this month, it is valued at 14 billion KRW(~10 million USD).
CIT networks with leading global partners, such as Huawei or Harvard Medical School, in the telecommunications and medical fields. CIT has been steadily participating in international exhibitions such as the World IT Show 2024(WIS2024) and Mobile World Congress 2024(MWC2024), establishing its position in the worldwide market. In addition, PTFE-based FCCLs are expected to gain a larger market position due to their versatility in Next-G communications markets such as autonomous vehicles, urban air mobility (UAM), AI, and IoT.
Seung Jeong, the CEO of CIT, reaffirmed the company's commitment to growing and meeting customer demands. He stated, "Our technology is essential across all industries, and it attracted interest from various sectors, including electronics and medical devices. In light of this, we prioritize the company's growth and enhance production capacity, and we actively seek investment in further advancement of our technology."
DK Kim Reporter davis@aving.net
출처 : AVING NEWS(https://us.aving.net)